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Optimizing LED Display Durability: The Key Role of Packaging Technology
2025-01-09 17

As the demand for large-sized LED displays in advertising, entertainment, and urban development continues to grow, ensuring that these displays are not only visually striking but also durable enough has become a crucial consideration. Packaging technology plays a key role in enhancing both the performance and durability of LED displays, especially in high-demand dynamic environments. At Sansi, we adopt industry-leading packaging technologies to ensure that every display operates reliably in various environments.

 


 

How Packaging Technology Enhances the Performance and Durability of LED Displays

 

The long-term performance of LED displays is not only determined by their design and materials but also closely linked to their packaging technology. Packaging technology is crucial in improving brightness, color consistency, and heat dissipation, particularly in high-load, high-temperature, and vibrating environments. It plays a decisive role in the stability and durability of the display. Let’s dive into some leading packaging technologies and how they enhance the long-term performance of LED displays.

 


SMD (Surface-Mount Diode) Technology

SMD packaging technology directly mounts LED chips on the surface of the circuit board, allowing the display to achieve higher resolution and greater brightness. The advantages of this technology are not only in exceptional display quality but also in its excellent heat dissipation, effectively preventing performance degradation due to overheating, thus ensuring the long-term stable operation of the display.

 

COB (Chip on Board) Technology

COB packaging technology directly integrates multiple LED chips onto a single substrate, reducing the connection points present in traditional SMD packaging. This significantly improves the display’s brightness and color consistency while reducing issues like brightness decay. Since the LED chips are in direct contact with the heat sink substrate, COB packaging provides excellent heat dissipation, extending the display’s lifespan and preventing thermal damage.

 

VOB (Vertical on Board) Technology

VOB technology LED displays offer multiple protective features, ensuring stability and durability in various environments. They are equipped with functions such as waterproof, moisture-proof, dust-proof, and impact resistance, effectively preventing external factors from damaging the display. Additionally, the nanocoating on VOB displays blocks moisture and dust, extending their lifespan. Moreover, VOB displays also feature anti-oxidation, blue light reduction, and vibration resistance, ensuring optimal performance during transportation, installation, and long-term use. By integrating all these protective functions, VOB technology provides a reliable and long-lasting display solution.

 

MCOB (Multiple Chip on Board) Technology

The manufacturing process of MCOB differs from traditional COB. MCOB (Multi Chips On Board) technology involves placing chips in a cup-shaped structure with optical design, allowing for optimization of the component's performance based on predetermined optical characteristics. The design also accommodates multiple sets of cup-shaped optical structures for integration, thereby providing superior light output effects for single LED components. This effectively utilizes physical optics to enhance the overall luminous efficiency of the components. MCOB can also meet the packaging demands for both low and high power applications.

 

Integration of Packaging Technology with Display Design


At Sansi, our display designs not only focus on visual effects but also consider the external factors affecting the displays, such as building structural movements, temperature changes, and vibrations. By optimizing packaging materials and technologies, we ensure that our displays can adapt to environmental changes and avoid issues such as seams or damage caused by expansion, contraction, or vibration.

Thermal Expansion: COB packaging technology is particularly effective at handling high-temperature environments, providing excellent heat dissipation and reducing the impact of thermal expansion on the display.

Shock Resistance: MCOB and VOB packaging technologies offer shock resistance, ensuring the display operates stably in high-vibration environments and reducing display issues.

Long-Term Stability: SMD and COB packaging technologies guarantee the long-term stability of displays, maintaining exceptional display quality even in large-scale installations and varying weather conditions.

 

Packaging technology is at the core of ensuring that LED displays operate stably and efficiently in diverse environments. By adopting SMD, COB, VOB, and MCOB technologies, Sansi is able to provide high-performance, durable LED displays that meet a wide range of application needs, from billboards to large outdoor displays.

 

If you’re looking to enhance performance in your next project with LED displays, Sansi’s packaging technology and innovative design offer the ideal solution. Contact us today, and let’s work together to bring your vision to life.